Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Patent
1998-05-21
1999-09-21
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
438106, 438455, H01L 2144, H01L 2148, H01L 2150
Patent
active
059565756
ABSTRACT:
Microconnectors are described that can be fabricated on circuitry, the microconnectors for physically and/or electrically connecting separate structures. The microconnectors permit partitioning of a function among a plurality of chips. The microconnectors include a latching member.
REFERENCES:
patent: 5033970 (1991-07-01), Buchoff
patent: 5413964 (1995-05-01), Massingill et al.
patent: 5656547 (1997-08-01), Richards et al.
Bertin Claude Louis
Cronin John Edward
Collins Deven
International Business Machines - Corporation
Leas James M.
Picardat Kevin M.
LandOfFree
Microconnectors does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Microconnectors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microconnectors will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-90762