Microcomputer board having wire-wrap terminals

Registers – Transfer mechanism – Traveling pawl

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174 685, H05K 708

Patent

active

040313719

ABSTRACT:
A microcomputer board has a first section with fixedly mounted microcomputer components interconnected by a printed circuit, and a second section having unconnected wire-wrap terminals adapted to receive DIP components. Wire-wrap terminals are provided for interconnecting the printed circuit with the wire-wrap section of the board, and additional wire-wrap terminals are provided for I/O connections. A ground plane extends between the wire-wrap connectors, on one side of the board, and voltage planes extend between the wire-wrap terminals on the other side of the board. Wire-wrap terminals may be provided in the wire-wrap section of the board and connected to the voltage and ground planes.

REFERENCES:
patent: 3670208 (1972-06-01), Hovnanian
patent: 3751645 (1971-08-01), Brandsma et al.
patent: 3780211 (1973-12-01), Vernet
patent: 3917984 (1975-11-01), Kong et al.
patent: 3935372 (1976-01-01), Triplett et al.

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