Microcomponent having intra-layer electrical isolation with...

Details Microcomponent having intra-layer electrical isolation with... Microcomponent having intra-layer electrical isolation with...

2005-04-12

2005-04-12

Lee, Eddie (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

C257S622000, C257S623000

Reexamination Certificate

active

06879016

ABSTRACT:
A system and method is disclosed that strengthens the structural integrity of trench-fill electrical isolation techniques. One embodiment provides for etching a series of interlocking geometric trenches into a device layer and filling the trenches with a non-conductive dielectric material. The dielectric material establishes electrical isolation while the interlocking geometric trenches strengthen the structural integrity of the separation by providing at least one surface on the interlocking separation that experiences a compression force for each direction that the electrically isolated MEMS component is moved.

REFERENCES:
patent: 5811315 (1998-09-01), Yindeepol et al.
patent: 5846849 (1998-12-01), Shaw et al.
patent: 6051866 (2000-04-01), Shaw et al.
patent: 6121552 (2000-09-01), Brosnihan et al.
patent: 6239473 (2001-05-01), Adams et al.
patent: 6291875 (2001-09-01), Clark et al.
patent: 6428713 (2002-08-01), Christenson et al.
patent: 6573154 (2003-06-01), Sridhar et al.
Zhang, Dacheng et al., “A novel isolation technology in bulk micromachining using deep reactive ion etching and a polysilicon refill”, Journal of J. Micromech. Microeng. vol. 11 (2001—pp. 13-19.
Muller, Lilac et al., “Electrical Isolation Process for Molded, High-Aspect-Ratio Polysilicon Microstructures”, Dept. of Mechanical Engineering, Univeristy of California at Berkeley, 6 pages.
Ayazi, Farrokh, et al., Journal of J. Microelectromechanical Systems, vol. 9, No. 3, (Sep. 2000), pp. 288-294.
Forsberg, M., et al., “Shallow and Deep Trench Isolation for use in RF-Bioplar IC:s”, Applied Materials, 4 pages.

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