Microcircuit package with integrated acoustic isolator

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices

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310317, 310318, 310319, 310311, 310322, 310334, 333186, H01L 4108

Patent

active

056506856

ABSTRACT:
A microcircuit package with an integrated acoustic isolator made up of a stacked acoustic filter. The package includes a rigid, electrically conductive housing with a IC module mounted therein. The acoustic filter includes two electroacoustic transducers mounted on opposite sides of a common wall of the package, one inside the package and the other outside. An a.c. power source is connected to the transducer that is mounted on the outside of the package. Electrical energy from the power source is converted by the outside transducer into acoustic energy which is conducted through the package wall to the inside transducer which reconverts the acoustic energy into electrical energy. The package wall has a significant thickness in comparison to the acoustic wavelength of the filter passband and is preferably equal to an integer number of one-half acoustic wavelengths. The transducer-wall combination acts as a filter having a passband tailored to prevent high-power microwave energy from being transmitted through the package wall.

REFERENCES:
patent: 3174122 (1965-03-01), Fowler et al.
patent: 3521089 (1970-07-01), Stuetzer
patent: 4450376 (1984-05-01), Meitzler
patent: 4798990 (1989-01-01), Henoch
patent: 4864179 (1989-09-01), Lapetina et al.
patent: 5034753 (1991-07-01), Weber
patent: 5229553 (1993-07-01), Lester et al.
"Stacked Acoustic Filters for High Power Microwave Electromagnetic (HPM-E Isolation" by J. Kosinski et al. Feb., 1991.
Research and Development Technical Report, SLCET-TR-91-6, US Army Laboratory Command.
Kosinski, J. & Baidy, E., "Stock Acoustic Filters for High Power Microwave Electromagnetic (HPM-EMI) Isolation", U.S. Army Laboratory Command, ETDL, R&D Technical Report; SLCET-TR-91-6, Feb. 1991.

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