Microcircuit package formed of multi-components

Details Microcircuit package formed of multi-components Microcircuit package formed of multi-components

1978-11-03

1981-04-14

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 80, 357 73, 174 52FP, 174 52S, H01L 2302, H01L 2312, H01L 3902

Patent

active

042623006

ABSTRACT:
A multi-component microcircuit package is formed from a plurality of separate components which are secured together to form a lower package portion using a base and a continuous composite side wall frame having irregularities on its upper surface as a result of the component junctions. Secured to the top of this side wall frame is a one-piece continuous top frame member having a uniform upper surface. This top frame member covers the irregularities present in side wall frame and provides a surface more suitable for hermetic sealing of a package lid to the package.

REFERENCES:
patent: 3340602 (1967-09-01), Hontz
patent: 3374537 (1968-03-01), Doelp
patent: 3404213 (1968-10-01), Brookover
patent: 3408451 (1968-10-01), Redwanz
patent: 3546543 (1970-12-01), Hessinger
patent: 3619734 (1971-11-01), Assour
patent: 3644798 (1972-02-01), Ihochi
patent: 3663868 (1972-05-01), Noguchi et al.
patent: 3697666 (1972-10-01), Wakley et al.
patent: 3726006 (1973-04-01), Muckelroy
patent: 3753054 (1973-08-01), Johnson

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