Microcircuit package assembly utilizing large size die and low t

Details Microcircuit package assembly utilizing large size die and low t Microcircuit package assembly utilizing large size die and low t

1994-02-14

1996-04-02

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257783, 257782, H01L 2348

Patent

active

055043747

ABSTRACT:
An ASIC type microcircuit package assembly has a die of at least about 20 millimeters square in size and utilizes as a die attach a polymeric adhesive incorporating a conductive filler. Such microcircuit package assemblies are produced by bonding the die to a substrate with the die attach, curing the die attach, and hermetically sealing the die bonded to the substrate. The microcircuit package assemblies thereby produced are characterized by stability at temperatures of up to about 360.degree. C. and under conditions of stress corresponding to a 12 pound pull following 1,000 temperature cycles between -65.degree. and 150.degree. C., and having a moisture level of less than about 5000 ppm.

REFERENCES:
patent: 4785075 (1988-11-01), Shimp
patent: 4839442 (1989-06-01), Craig, Jr.
patent: 5150195 (1992-09-01), Nguyen
patent: 5155066 (1992-10-01), Nguyen
patent: 5195299 (1993-03-01), Nguyen
patent: 5399907 (1995-03-01), Nguyen et al.
Sue Oliver et al., "Silver/Polymer Die Attach for Ceramic Package Assembly" Proceedings of the 1992 Int'l Electronics Packaging Society Conference, Sep. 26, 1992.

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