Microcircuit package and sealing method

Details Microcircuit package and sealing method Microcircuit package and sealing method

1982-10-12

1984-10-16

Edlow, Martin H.

357 72, 357 73, 357 74, A01L 3902, A01L 2328, A01L 2330, A01L 2302

Patent

active

044778287

ABSTRACT:
A microcircuit package and sealing method in which a non-organic coating is used to hermetically seal the microcircuit. The microcircuit is isolated and insulated in order to protect the microcircuit from the high temperature required to apply and cure a non-organic coating. The materials and methods used to isolate and insulate the microcircuit are chosen so that the thermal coefficients of the materials are complementary and thus form a highly reliable, durable seal, while also insulating the microcircuit during the process of applying the non-organic coating.

REFERENCES:
patent: 3271634 (1966-09-01), Heaton
patent: 3489845 (1970-01-01), Landron
patent: 3622419 (1971-11-01), London et al.

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