Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1984-05-23
1987-01-06
Hearn, Brian E.
Metal working
Method of mechanical manufacture
Assembling or joining
29591, 174 52FP, 357 72, H05K 506, H01L 2330
Patent
active
046335730
ABSTRACT:
A microcircuit package and sealing method in which a non-organic coating is used to hermetically seal the microcircuit. The microcircuit is isolated and insulated in order to protect the microcircuit from the high temperatures required to apply and cure a non-organic coating. The materials and methods used to isolate and insulate the microcircuit are chosen so that the thermal coefficients of the materials are complementary and thus form a highly reliable, durable seal, while also insulating the microcircuit during the process of applying the non-organic coating.
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Arnold S. Rose and Manfred K. Fischer, Advanced Technology Center, Signetics Corporation Sunnyvale, Calif., Premolded Plastic IC Packages: Characteristics and Applications.
Aegis, Inc.
Hearn Brian E.
Hey David A.
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