Microcircuit cooling for vanes

Fluid reaction surfaces (i.e. – impellers) – With heating – cooling or thermal insulation means – Changing state mass within or fluid flow through working...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C029S889721

Reexamination Certificate

active

11286794

ABSTRACT:
A turbine engine component has an airfoil portion with a suction side. The component includes a cooling microcircuit embedded within a wall structure forming the suction side. The cooling microcircuit has at least one cooling film hole positioned ahead of a gage point for creating a flow of cooling fluid over an exterior surface of the suction side which travels past the gage point. The cooling microcircuit is formed using refractory metal core technology. A method for forming the cooling microcircuit is described.

REFERENCES:
patent: 2005/0031452 (2005-02-01), Liang
patent: 2007/0104576 (2007-05-01), Cunha et al.
patent: 2001-107704 (2001-04-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Microcircuit cooling for vanes does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microcircuit cooling for vanes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microcircuit cooling for vanes will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3917128

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.