Microchip module assemblies

Details Microchip module assemblies Microchip module assemblies

1996-01-31

1998-07-21

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361783, 361803, 438108, 438109, 438615, 257737, 257738, 257788, 29841, H05K 702, H01L 2329, H01L 2331

Patent

active

057842612

ABSTRACT:
Low profile microchip module assemblies are formed by first mounting one or more active semiconductor integrated circuit chips on a multilayer metallization and dielectric structure on a substrate of, say, silicon or alumina, by wire bonding or flip-chip solder bonding, and then inverting the substrate and mounting it on a printed circuit board by means of solder bump connections. The solder bump connections are sufficiently high for the chips to be held clear of the printed circuit board.

REFERENCES:
patent: 5249101 (1993-09-01), Frey et al.
patent: 5533256 (1996-07-01), Call et al.
patent: 5616958 (1997-04-01), Laine et al.

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