Microchip manufacturing method

Details Microchip manufacturing method Microchip manufacturing method

2011-03-08

2011-03-08

Tucker, Philip C (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S247000, C156S272800, C156S275500, C156S292000, C156S345420

Reexamination Certificate

active

07901527

ABSTRACT:
Provided is a microchip manufacturing method by which a functional film is formed in a flow path channel and resin microchip substrates are bonded. The manufacturing method has a first step of forming SiO2 films (12, 22) representing the functional films on a surface having a flow path channel (11) of a microchip substrate (10) and on a surface having a flow path channel (21) of a microchip substrate (20) respectively; a second step of exfoliating the SiO2films formed on the microchip substrates (10, 20) except the SiO2films formed on the flow path channels (11, 21) by a cohesive member; and a third step of placing the microchip substrates (10, 20) one over another in such a way that the surfaces on which the flow path channels (11, 21) are formed face inside, and bonding the substrates by laser welding, ultrasonic wave welding or thermocompression bonding.

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