Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2006-06-13
2006-06-13
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C438S129000, C438S612000, C438S619000, C029S829000, C029S846000, C029S854000, C029S857000, C257S692000, C257S773000, C257S775000, C257S786000
Reexamination Certificate
active
07060537
ABSTRACT:
A reliable microchip controller board and a manufacturing method thereof suitable for mass production are provided. A board wherein a programmable microchip controller is mounted includes; terminals for writing a program into the microchip controller and a circuit pattern connecting an operating terminal to shared terminals which are disconnected. A non-programmed microchip controller is mounted on the board in a state where patterns are disconnected and then programmed. The disconnected portion is connected thereafter.
REFERENCES:
patent: 4635165 (1987-01-01), Okuaki
patent: 5479694 (1996-01-01), Baldwin
patent: 6285081 (2001-09-01), Jackson
patent: 6646349 (2003-11-01), Pu et al.
patent: 01140650 (1989-06-01), None
Chambliss Alonzo
Minebea Co. Ltd.
Oliff & Berridg,e PLC
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