Microchip assembly with electrical element in sealed cavity

Details Microchip assembly with electrical element in sealed cavity Microchip assembly with electrical element in sealed cavity

1992-04-23

1994-11-22

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Device held in place by clamping

257701, 257704, H01L 2302, H01L 2312, H01L 2316

Patent

active

053671945

ABSTRACT:
A method of producing a microchip having at least a portion of an electrical circuit element contained within a hermetically sealed enclosure comprising the steps of: forming a cavity in a first substrate assembly which has a cavity opening at a first surface portion of the first substrate assembly; forming an electrical circuit element and sealing ring from a film applied to a first surface portion of a second substrate assembly with the sealing ring arranged in circumscribing relationship with at least a portion of the circuit element; positioning the first surface portion of the first substrate assembly opposite the first surface portion of the second substrate assembly with the sealing ring located in circumscribing relationship with the cavity opening; sealingly bonding the sealing ring to the first surface portion of the first substrate assembly.

REFERENCES:
patent: 4107555 (1978-08-01), Hass et al.
patent: 5177595 (1993-01-01), Beatty

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