Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1995-02-21
1996-02-13
Bradley, P. Austin
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228246, 228254, B23K 3102, B23K 3514
Patent
active
054906288
ABSTRACT:
A method of producing a microchip having at least a portion of an electrical circuit element contained within a hermetically sealed enclosure comprises the steps of: forming a cavity in a first substrate assembly which has a cavity opening at a first surface portion of the first substrate assembly; forming an electrical circuit element and sealing ring from a film applied to a first surface portion of a second substrate assembly with the sealing ring arranged in circumscribing relationship with at least a portion of the circuit element; positioning the first surface portion of the first substrate assembly opposite the first surface portion of the second substrate assembly with the sealing ring located in circumscribing relationship with the cavity opening; sealingly bonding the sealing ring to the first surface portion of the first substrate assembly.
REFERENCES:
patent: 3404215 (1968-10-01), Burks et al.
patent: 3512254 (1970-05-01), Jenkins et al.
patent: 4372037 (1983-02-01), Scapplf et al.
patent: 4769272 (1988-09-01), Byrne et al.
Patent Abstracts of Japan Sep. 5, 1985 Hitachi.
European Patent Application No. EP 91 30 9745 Search Report dated Oct. 30, 1992.
Bradley P. Austin
Hewlett--Packard Company
Knapp Jeffrey T.
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