Microchannel cooling device for small heat sources

Details Microchannel cooling device for small heat sources Microchannel cooling device for small heat sources

2006-06-28

2010-11-23

McKinnon, Terrell L (Department: 3744)

Heat exchange

With retainer for removable article

Electrical component

C165S104330, C165S185000, C361S689000, C361S702000

Reexamination Certificate

active

07836940

ABSTRACT:
According to the invention, an apparatus for transferring heat with a target is disclosed. The apparatus may include a body which defines a surface, inlet port, inlet manifold passages, heat transfer passages, outlet manifold passages, and outlet port. The surface may couple the target with the body. The inlet port may be configured to receive and direct a fluid into inlet manifold passages. The inlet manifold passages may be configured to receive and direct the fluid to the heat transfer passages. The heat transfer passages may be configured to receive and direct the fluid in a direction substantially parallel to the surface and substantially perpendicular the input manifold passages. The outlet manifold passages may be configured to receive and direct the fluid to an outlet port. The outlet port may be configured to receive and output the fluid.

REFERENCES:
patent: 3455376 (1969-07-01), Beurtheret
patent: 4450472 (1984-05-01), Tuckerman et al.
patent: 4573067 (1986-02-01), Tuckerman et al.
patent: 4744414 (1988-05-01), Schon
patent: 5005640 (1991-04-01), Lapinski et al.
patent: 5144531 (1992-09-01), Go et al.
patent: 5265670 (1993-11-01), Zingher
patent: 5835345 (1998-11-01), Staskus et al.
patent: 6084774 (2000-07-01), Bartley et al.
patent: 6301109 (2001-10-01), Chu et al.
patent: 2001/0016985 (2001-08-01), Insley et al.
patent: 2004/0031281 (2004-02-01), Vaiyapuri et al.
M.G. Grote et al.,Test Results of Water Thin Coolers at Heat Fluxes from 5 to 125 W/cm2, McDonnell Douglas Corp., SAE Technical Paper Series, SAE The Engineering Society for Advancing Mobiity Land Sea Air and Space, Jul. 11-13, 1988, pp. 1-13, Society of Automotive Engineers, Inc., US.
R.E. Hendron et al.,Stackable wafer thin coolers for high power laser diode arrays, McDonnell Douglas Electronic Systems Company, 1990, pp. 330-340, vol. 1219, SPIE Laser-Diode Technology and applications II, US.
X.A. Zhu et al.,Thermal-Fluid Modeling of Microchannel Cooling for High Power Solid-State Laser, Air Force Research Laboratory, Wright-Patterson AFB, May 24, 2003, pp. 1-26, Ohio, US.
G.O. Campbell et al. “Enhanced Microchannel Cooler Development,” ENMC01-05, Jan. 26, 2003, pp. 103, Final Report, Item 0001AE, microVection, Inc., USA.

Affiliated with

Also associated with

Rating

Microchannel cooling device for small heat sources does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microchannel cooling device for small heat sources, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microchannel cooling device for small heat sources will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4246399