Microcavity structures, fabrication processes, and applications

Details Microcavity structures, fabrication processes, and applications Microcavity structures, fabrication processes, and applications

1995-03-30

1996-05-07

Nimmo, Morris H.

Electricity: conductors and insulators

With fluids or vacuum

With cooling or fluid feeding, circulating or distributing

174 161, 257277, 257418, 257506, 257531, 257632, 257647, 257714, 257776, 336200, 361748, 361689, H05K 720

Patent

active

055148328

ABSTRACT:
A method is presented for controlled formation of microcavities for various semiconductor and micro-machine applications. The method involves the steps of defining a void in a support structure, sealing the void with a resilient gas-permeable material such that a chamber is formed, diffusing gas into the chamber through the gas permeable material to create a pressurized chamber, and then allowing expansion of the pressurized chamber within the resilient material, thereby creating an enlarged cavity. The applications set forth include the production of large capacitors, field isolation structures, tubular sensors for chromatography, pressure sensors, and cooling channels for integrated circuits.

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Aboaf, J. A.. et al; "Dielectric isolation"; IBM Technical Bulletin; vol. 18 No. 10; Mar. 1976; p. 3295.

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