Microcasting of microminiature tips

Stock material or miscellaneous articles – Structurally defined web or sheet – Including aperture

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156644, 156647, 156651, 156653, 156657, 1566591, 1566611, 156662, 357 69, 428614, 428632, 428209, 437182, 437228, 437245, B32B 310, H01L 21306, B44C 122, C03C 1500

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049160028

ABSTRACT:
A microminiature tip and tip assembly is fabricated using microelectronic fabrication techniques. A masking aperture is formed in a dielectric layer which overlies a (100) silicon substrate. For a square aperture, a pyramidal pit is anisotropically etched into the surface of the silicon substrate. Tungsten is selectively deposited in the pit to form a pyramid-shaped microminiature point. Continued deposition of tungsten fills the aperture to form a base portion of the tip which integrally locks the tip to the dielectric layer, which is fabricated to form a support member for the tip.

REFERENCES:
patent: 4307507 (1981-12-01), Gray et al.
patent: 4312117 (1982-12-01), Robillard et al.
patent: 4585991 (1986-04-01), Reid et al.
patent: 4685996 (1987-08-01), Busta et al.
patent: 4786545 (1988-11-01), Sakuma et al.
Kiewit, "Microtool Fabrication by Etch Pit Replication", Rev. Sci. Instrum., vol. 44, No. 12, Dec. 1973, pp. 1741-1742, 156-647.

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