Microcapsules used in image-forming substrate and process of pro

Coating processes – Particles – flakes – or granules coated or encapsulated – Solid encapsulation process utilizing an emulsion or...

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42721334, 42721336, 264 41, 264 433, 264 44, 264 47, B01J 1302, B01J 1304, B01J 1320, B01J 1322

Patent

active

061399140

ABSTRACT:
A microcapsule includes a shape memory resin shell wall formed with fissures that do not completely pass through the shell wall, and a dye encapsulated in the shell wall. The shell wall exhibits a temperature/pressure characteristic such that the fissures open, when the shell wall is squashed and compacted under a predetermined pressure at a predetermined temperature, whereby a seepage of the dye frog the squashed and compacted shell wall through the opened fissures is adjustable.

REFERENCES:
patent: 4399209 (1983-08-01), Sanders et al.
patent: 4440846 (1984-04-01), Sanders et al.
patent: 4644376 (1987-02-01), Usami et al.
patent: 5645920 (1997-07-01), Nishiyama

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