Microcapsules and emulsions containing low bloom gelatin and...

Details Microcapsules and emulsions containing low bloom gelatin and... Microcapsules and emulsions containing low bloom gelatin and...

2005-11-29

2005-11-29

Acquah, Samuel A. (Department: 1711)

Drug, bio-affecting and body treating compositions

Preparations characterized by special physical form

Particulate form

C264S004100, C264S004300, C264S004320, C264S004330, C264S004400, C264S004700, C428S402210, C428S402240, C428S403000, C424S494000, C424S496000, C424S497000, C424S498000

Reexamination Certificate

active

06969530

ABSTRACT:
Described herein are microcapsules and emulsions prepared from low Bloom gelatin and methods of making and using thereof.

REFERENCES:
patent: 2800457 (1957-07-01), Green et al.
patent: 4217370 (1980-08-01), Rawlings et al.
patent: 4219439 (1980-08-01), Miyake et al.
patent: 4222891 (1980-09-01), Okimoto et al.
patent: 4695466 (1987-09-01), Morishita et al.
patent: 4744933 (1988-05-01), Rha et al.
patent: 4749620 (1988-06-01), Rha et al.
patent: 4861627 (1989-08-01), Mathiowitz et al.
patent: 4895725 (1990-01-01), Kantor et al.
patent: 5051304 (1991-09-01), David et al.
patent: 5059622 (1991-10-01), Sears
patent: 5204029 (1993-04-01), Morgan et al.
patent: 5456985 (1995-10-01), Zgoulli et al.
patent: 5573934 (1996-11-01), Hubbell et al.
patent: 5670209 (1997-09-01), Wyckoff
patent: 5766637 (1998-06-01), Shine et al.
patent: 5780056 (1998-07-01), Akamatsu et al.
patent: 5827531 (1998-10-01), Morrison et al.
patent: 5993851 (1999-11-01), Foldvari
patent: 6019998 (2000-02-01), Nomoto et al.
patent: 6020200 (2000-02-01), Enevold
patent: 6103378 (2000-08-01), Yao et al.
patent: 6221401 (2001-04-01), Zasadzinski et al.
patent: 6234464 (2001-05-01), Krumbholz et al.
patent: 6274174 (2001-08-01), Hom-ma et al.
patent: 6325951 (2001-12-01), Soper et al.
patent: 6528165 (2003-03-01), Chandler
patent: 6534091 (2003-03-01), Garces Garces et al.
patent: 6534094 (2003-03-01), Moyano et al.
patent: 6534926 (2003-03-01), Miller et al.
patent: 6544926 (2003-04-01), Bodmer et al.
patent: 0 301 777 (1989-02-01), None
patent: 0416575 (1991-03-01), None
patent: 1 116 516 (2001-07-01), None
patent: 2 115 768 (1983-09-01), None
patent: 1148338 (1989-06-01), None
patent: WO 92/11083 (1992-07-01), None
patent: WO 97/13416 (1997-04-01), None
patent: WO 2004/041251 (2004-05-01), None
Abstract: Beestman; “Microencapsulation of Solid Particles,”Am. Chem. Soc., 2000, Accession No. 2000:793223.
Abstract: Kage et al., “Microencapsulation of mono-dispersed droplets by complex coacervation and menbrane thickness of generated capsules,” Accession No.: 1997:615273 CAPLUS.
Abstract: Yoshida et al., “Manufacture of microcapsules from complex coacervation processes,” Accession No.: 1990:140735 CAPLUS.
Ijichi et al., “Multi-Layered Gelatin/Acacia Microcapsules by Complex Coacervation Method,”Journal of Chemical Engineering of Japan, vol. 30(5), pp. 793-798, 1997.
Thimma et al., “Study of complex coacervation of gelatin with sodium carboxymethyl guar gum: Microencapsulation of clove oil and sulphamethoxazole,”J. Microencapsulation, Vo;. 20(2), pp. 203-210, 2003.
U.S. Patent and Trademark Office—Office Action dated Feb. 10, 2005, Examiner: Samuel A. Acquah, U.S. Appl. No. 10/120,621, filed Apr. 11, 2002.
Response to Office Action dated Feb. 10, 1005, filed Mar. 2005.
U.S. Patent and Trademark Office—Office Action dated Nov. 20, 2003, Examiner: Samuel A. Acquah, U.S. Appl. No. 10/120,621, filed Apr. 11, 2002.
Response to Office Action dated Nov. 20, 2003, filed Apr. 13, 2004.

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