Radiation imagery chemistry: process – composition – or product th – Microcapsule – process – composition – or product
Reexamination Certificate
2006-01-17
2006-01-17
Walke, Amanda (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Microcapsule, process, composition, or product
C430S270100, C430S905000, C428S402210, C428S402220
Reexamination Certificate
active
06986979
ABSTRACT:
This invention relates to a composition comprising microcapsules suspended in an aqueous media, said microcapsules comprising a water immiscible material contained within an encapsulating wall of polymeric material, wherein the aqueous media contains a stabilizer comprising an anionic polymer mixture comprising a first sulfonated polystyrene polymer and a second sulfonated polystyrene polymer wherein the ratio of the weight average polymer molecular weight of the first polymer to the second polymer is greater than 2. It further relates to an imaging element comprising said microcapsules.
REFERENCES:
patent: 4842978 (1989-06-01), Ishikawa
patent: 4977060 (1990-12-01), Liang et al.
patent: 4997874 (1991-03-01), Asano et al.
patent: 5120475 (1992-06-01), Chen et al.
patent: 5264316 (1993-11-01), Yamada et al.
patent: 5283015 (1994-02-01), Hutchings et al.
patent: 5643506 (1997-07-01), Rourke
patent: 5647896 (1997-07-01), Nishimura et al.
patent: 6468708 (2002-10-01), Wang et al.
patent: 6537717 (2003-03-01), Gao et al.
patent: 6635399 (2003-10-01), Higuchi et al.
Yongcai Wang et al., Process of Producing Microcapsules and Product Thereof, filed on even date herewith.
Hoderlein Paul M.
Rollinson Peter D.
Wang Yongcai
Eastman Kodak Company
Meeks Roberts Sarah
Walke Amanda
LandOfFree
Microcapsule composition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Microcapsule composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microcapsule composition will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3543546