Microcantilever heater-thermometer with integrated...

Electric heating – Heating devices – Combined with container – enclosure – or support for material...

Reexamination Certificate

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C073S766000, C219S446100

Reexamination Certificate

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07928343

ABSTRACT:
The present invention provides microcantilever hotplate devices which incorporate temperature compensating strain sensors. The microcantilever hotplate devices of the present invention comprise microcantilevers having temperature compensating strain sensors and resistive heaters. The present invention also provides methods for using a microcantilever hotplate for temperature compensated surface stress measurements, chemical/biochemical sensing, measuring various properties of compounds adhered to the microcantilever hotplate surface, or for temperature compensated deflection measurements.

REFERENCES:
patent: 4166269 (1979-08-01), Stephens et al.
patent: 5345815 (1994-09-01), Albrecht et al.
patent: 5386720 (1995-02-01), Toda et al.
patent: 5441343 (1995-08-01), Pylkki et al.
patent: 5444244 (1995-08-01), Kirk et al.
patent: 5451371 (1995-09-01), Zanini-Fisher et al.
patent: 5464966 (1995-11-01), Gaitan et al.
patent: 5583286 (1996-12-01), Matsuyama
patent: 5801070 (1998-09-01), Zanini-Fisher et al.
patent: 5929438 (1999-07-01), Suzuki et al.
patent: 5936237 (1999-08-01), van der Weide
patent: 5969238 (1999-10-01), Fischer
patent: 6050722 (2000-04-01), Thundat et al.
patent: 6073485 (2000-06-01), Kitamura
patent: 6094971 (2000-08-01), Edwards et al.
patent: 6096559 (2000-08-01), Thundat et al.
patent: 6097197 (2000-08-01), Matsuyama et al.
patent: 6383823 (2002-05-01), Takahashi et al.
patent: 6436346 (2002-08-01), Doktycz et al.
patent: 6452170 (2002-09-01), Zypman et al.
patent: 6467951 (2002-10-01), Ghoshal
patent: 6487515 (2002-11-01), Ghoshal
patent: 6535824 (2003-03-01), Mansky et al.
patent: 6583412 (2003-06-01), Williams
patent: 6667467 (2003-12-01), Shimizu et al.
patent: 6762402 (2004-07-01), Choi et al.
patent: 6763705 (2004-07-01), Thundat et al.
patent: 6785041 (2004-08-01), Vodopyanov
patent: 6893884 (2005-05-01), Shi et al.
patent: 6894272 (2005-05-01), Kranz et al.
patent: 6930502 (2005-08-01), Lee et al.
patent: 6932504 (2005-08-01), Takahashi et al.
patent: 6935167 (2005-08-01), Sahin et al.
patent: 7033840 (2006-04-01), Tagge et al.
patent: 7038996 (2006-05-01), Binnig et al.
patent: 7074340 (2006-07-01), Lugstein et al.
patent: 7155964 (2007-01-01), Huang et al.
patent: 7168298 (2007-01-01), Manginell et al.
patent: 7208730 (2007-04-01), Berstis
patent: 7211789 (2007-05-01), Berstis
patent: 7260980 (2007-08-01), Adams et al.
patent: 7261461 (2007-08-01), Grudin et al.
patent: 7268348 (2007-09-01), Binning et al.
patent: 7281419 (2007-10-01), Wang et al.
patent: 7291466 (2007-11-01), Su et al.
patent: 7404314 (2008-07-01), Sahin et al.
patent: 7451638 (2008-11-01), Sahin et al.
patent: 7521257 (2009-04-01), Adams et al.
patent: 2003/0101006 (2003-05-01), Mansky et al.
patent: 2004/0195096 (2004-10-01), Tsamis et al.
patent: 2004/0223884 (2004-11-01), Chen et al.
patent: 2004/0228258 (2004-11-01), Binnig et al.
patent: 2005/0109081 (2005-05-01), Zribi et al.
patent: 2005/0127926 (2005-06-01), Lee et al.
patent: 2005/0164299 (2005-07-01), Stewart
patent: 2006/0032289 (2006-02-01), Pinnaduwage et al.
patent: 2006/0040057 (2006-02-01), Sheehan et al.
patent: 2006/0150720 (2006-07-01), Nakayama et al.
patent: 2006/0207317 (2006-09-01), Watanabe
patent: 2006/0222047 (2006-10-01), Reading
patent: 2006/0238206 (2006-10-01), Eng et al.
patent: 2006/0254345 (2006-11-01), King et al.
patent: 2007/0063141 (2007-03-01), Duerig et al.
patent: 2007/0109091 (2007-05-01), Landsberger et al.
patent: 2007/0114401 (2007-05-01), King et al.
patent: 2007/0125753 (2007-06-01), Fink et al.
patent: 2007/0189920 (2007-08-01), Gimzewski
patent: 2007/0190562 (2007-08-01), Berstis
patent: 2007/0286254 (2007-12-01), Fon et al.
patent: 2008/0093226 (2008-04-01), Briman et al.
patent: 2008/0283755 (2008-11-01), Dazzi et al.
patent: 2008/0295583 (2008-12-01), Giessibl
patent: 2009/0013770 (2009-01-01), Proksch et al.
patent: 2009/0139340 (2009-06-01), King et al.
patent: 2009/0249521 (2009-10-01), Dazzi et al.
patent: WO 9410822 (1994-05-01), None
patent: WO 03/011747 (2003-02-01), None
patent: WO 2006/046924 (2006-05-01), None
patent: WO 2006/073426 (2006-07-01), None
patent: WO 2006/107991 (2006-11-01), None
patent: WO 2007/011364 (2007-01-01), None
patent: WO 2007/026177 (2007-03-01), None
patent: WO 2008/143817 (2008-11-01), None
patent: WO 2009/097487 (2009-08-01), None
patent: WO 2010/022285 (2010-02-01), None
P.J. French, “Polysilicon: a versatile material for microsystems”, 2002, Sensors and Actuators A, 99, pp. 3-12.
Abedinov et al. (2001) “Micromachined Piezoresistive Cantilever Array With Integrated Resistive Microheater for Calorimetry and Mass Detection,”J. Vac. Sci Technol. A19(6):2884-2888.
Abel et al. (Jun. 2007) “Thermal Metrology of Silicon Microstructures Using Raman Spectroscopy,”IEEE Trans. Comp. Pack. Tech. 30(2):200-208.
Akiyama et al. (2000) “Integrated Atomic Force Microscopy Array Probe with Metal-Oxide-Semiconductor Field Effect Transistor Stress Sensor, Thermal Bimorph Actuator, and On-Chip Complementary Metal-Oxide-Semiconductor Electronics,”J. Vac. Sci. Technol. B18(6):2669-2675.
Berger et al. (Jul. 1, 1996) “Thermal Analysis Using a Micromechanical Calorimeter,”Appl. Phys. Lett. 69(1):40-42.
Binning et al. (Mar. 3, 1986) “Atomic Force Microscope,”Phys. Rev. Lett. 56(9):930-933.
Biswal et al. (2006) “Nanomechanical Detection of DNA Melting on Microcantilever Surfaces,”Anal. Chem. 78:7104-7109.
Biswal et al. (2007) “Using a Microcantilever Array for Detecting Phase Transitions and Stability of DNA,”Clin. Lab. Med. 27:163-171.
Boisen et al. (2000) “Environmental Sensors Based on Micromachined Cantilevers with Integrated Read-Out,”Ultramicroscopy82:11-16.
Chui et al. (Mar. 1998) “Low-Stiffness Silicon Cantilevers with Integrated Heaters and Piezoresistive Sensors for High-Density AFM Thermomechanical Data Storage,”J. Microelectrmech. Syst. 7(1):69-78.
Chui et al. (2007) “Advanced Temperature Compensation for Piezoresistive Sensors Based on Crystallographic Orientation,”Rev. Sci. Instrum. 78:043706.
Despont et al. (2000) “VLSI-NEMS Chip for Parallel AFM Data Storage,”Sens. Actuators A80:100-107.
Goericke et al. (2007) “Microcantilever Hotplates with Temperature-Compensated Peizoresistive Strain Sensors,”Sens. Actuators A143(2):181-190.
Hagleitner et al. (Nov. 15, 2001) “Smart Single-Chip Gas Sensor Microsystem,”Nature414:293-296.
Hull (1999) “Electrical Properties,” and “Implantation/ Irradiation of Silicon,” In;Properties of Crystalline Silicon, Ch. 8 and 14, INSPEC, London pp. 411-475 and 731-773.
Jensenius et al. (May 1, 2000) “A Microcantilever-Based Alcohol Vapor Sensor-Application and Response Model,”Appl. Phys. Lett. 76(18):2615-2617.
Kim et al. (2007) “Nanotopographical Imaging Using a Heated Atomic Force Microscope Cantilever Probe,”Sens. Actuators A136:95-103.
King et al. (Dec. 2002) “Design of Atomic Force Microscope Cantilevers for Combined Thermomechanical Writing and Thermal Reading in Array Operation,”J. Microelectromech. Syst. 11(6):765-774.
King et al. (2006) “Nanoscale Thermal Analysis of an Energetic Material,”Nano Lett. 6(9):2145-2149.
Lee et al. (Dec. 2006) “Electrical, Thermal, and Mechanical Characterization of Silicon Microcantilever Heaters,”J. Microelectromech. Syst. 15(6):1644-1655.
Lee et al. (2007) “Characterization of Liquid and Gaseous Micro- and Nanojets using Microcantilever Sensors,”Sens. Actuators A134:128-139.
Lee et al. (2007) “Microcantilever Hotplates: Design, Fabrication, and Characterization,”Sens. Actuators A136:291-298.
Lutwyche et al. (1999) “5×5 2D AFM Cantilever Arrays a First Step Towards a Terabit Storage Device,”Sens. Actuators A73:89-94.
Madou (1997) “Wet Bulk Micromachining,” and “Microfabrication Applications,” InFundamentals of Microfabriation, Ch. 4

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