Microbump interconnect for bore semiconductor dice

Details Microbump interconnect for bore semiconductor dice Microbump interconnect for bore semiconductor dice

1996-05-15

1998-09-15

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257737, 257779, 438613, 22818022, H01L 2348, H01L 2352, H01L 2940

Patent

active

058083600

ABSTRACT:
A method for forming an interconnect for making a temporary or permanent electrical connection to a semiconductor dice is provided. The method includes forming a substrate with an insulating layer and a pattern of conductors thereon. The conductors are formed as a bi-metal stack including a barrier layer formed of an inert metal and a conductive layer formed of a highly conductive metal. Microbumps are formed on the conductors by deposition through a mask using an electroplating, electroless plating, screen printing or evaporation process. The interconnect can be used to provide a temporary electrical connection for testing bare semiconductor dice. Alternately the interconnect can be used for flip chip mounting dice for fabricating multi chip modules and other electronic devices.

REFERENCES:
patent: 3809625 (1974-05-01), Brown et al.
patent: 4927505 (1990-05-01), Sharma et al.
patent: 5072289 (1991-12-01), Sugimoto et al.
patent: 5073117 (1991-12-01), Malhi
patent: 5088190 (1992-02-01), Malhi
patent: 5090118 (1992-02-01), Kwon et al.
patent: 5123850 (1992-06-01), Elder et al.
patent: 5172050 (1992-12-01), Swapp
patent: 5225037 (1993-07-01), Elder et al.
patent: 5239198 (1993-08-01), Lin et al.
patent: 5262718 (1993-11-01), Svendsen et al.
patent: 5289631 (1994-03-01), Koopman et al.
patent: 5302891 (1994-04-01), Wood et al.
patent: 5367253 (1994-11-01), Wood et al.
patent: 5376584 (1994-12-01), Agarwala
patent: 5408190 (1995-04-01), Wood et al.
patent: 5438223 (1995-08-01), Higashi et al.
patent: 5440240 (1995-08-01), Wood et al.
patent: 5461261 (1995-10-01), Nishiguchi
patent: 5487999 (1996-01-01), Farnworth
patent: 5550427 (1996-08-01), Hashi
patent: 5569960 (1996-10-01), Kumazawa et al.
patent: 5656858 (1997-08-01), Kondo et al.
Yamamoto, Yasuhikio et al., "Evaluation of New Micro-Connection System Using Microbumps", Nitto Denko Corp., Technical Paper, ISHM '93 Proceedings, pp. 370-378.
Miyake, Koyoshi et al., "Connectivity Analysis of New `Known Good Die` Connection System Using Microbumps", Technical Report, Nitto Denko Corp., pp. 1-7, 1994.
"Science Over Art. Our New IC Membrane Test Probe." Packard Hughes Interconnect Advertising Brochure, 1993.

Affiliated with

Also associated with

Rating

Microbump interconnect for bore semiconductor dice does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microbump interconnect for bore semiconductor dice, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microbump interconnect for bore semiconductor dice will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-91470