Microaccelerometer having low stress bonds and means for prevent

Details Microaccelerometer having low stress bonds and means for prevent Microaccelerometer having low stress bonds and means for prevent

1992-11-13

1994-02-08

Chapman, John E.

Measuring and testing

Speed, velocity, or acceleration

Acceleration determination utilizing inertial element

73514, G01P 1508

Patent

active

052840573

ABSTRACT:
A microaccelerometer is provided which has a silicon substrate bonded to a silicon capping plate and silicon back plate, wherein the bonds between the three silicon wafers are characterized by a relatively low residual stress level over a wide temperature range. The bonds are formed by means of an appropriate adhesive at a relatively low temperature without degradation to the microaccelerometer. The bonds between the silicon wafers also provide stress relief during use and packaging of the microaccelerometer. With this invention, the damping distance for the proof mass of the microaccelerometer is accurately controllable and stop means are provided for preventing excessive deflection of the proof mass in a direction perpendicular to the plane of the microaccelerometer.

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H. V. Allen, S. C. Terry, D. W. DeBruin, "Accelerometer Systems With Self-Testable Features", Sensors and Actuators, vol. 20, No. 1,2, pp. 153-161, (Nov. 15, 1989).

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