Micro surface mount coil unit

Details Micro surface mount coil unit Micro surface mount coil unit

2006-07-04

2006-07-04

Mai, Anh (Department: 2832)

Inductor devices

Core forms casing

C336S192000

Reexamination Certificate

active

07071803

ABSTRACT:
There is provided a micro surface mount coil unit in which the occurrence of positional shift and poor soldering at the time of soldering of the coil unit is avoided without decreasing the width of a coil winding portion of coil form, and the shock resistance of coil unit is increased. The coil unit10has a drum-shaped core11in which a coil form part around which a coil wire is wound is arranged between flange parts13and14and a lead frame12bondingly fixed to the lower flange part14. The lead frame12has left and right lead frame parts12A and12B bonded to the lower flange part14, and the outside surface of a bottom surface18of each of the lead frame parts12A and12B is separated into a first region forming an external connecting terminal15and a second region not forming the external connecting terminal15by notches17.

REFERENCES:
patent: 5307041 (1994-04-01), Kato et al.
patent: 5751203 (1998-05-01), Tsutsumi et al.
patent: 6292083 (2001-09-01), Tajima et al.
patent: 05036530 (1993-02-01), None
patent: 10-22137 (1998-01-01), None
patent: 11-283840 (1999-10-01), None

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