Micro-structured cooler and use thereof

Details Micro-structured cooler and use thereof Micro-structured cooler and use thereof

2011-08-02

2011-08-02

Duong, Tho V (Department: 3744)

Heat exchange

With retainer for removable article

Electrical component

C165S168000

Reexamination Certificate

active

07987899

ABSTRACT:
For providing a particularly efficient micro-structured cooler intended more specifically for cooling electronic components, it is proposed to proceed in the following manner to build this cooler: providing a stack of at least two metal foils (1) comprising channels (2) for coolant and one base plate (5) adapted to be brought into thermal contact with the electronic component (4) through a thermal contact surface (6), said metal foils (1) and said base plate (5) being joined together so as to form a single piece of material, said channels (2) having a width b ranging from 100 to 350 μm, a depth t ranging from 30 to 150 μm, a mean spacing s ranging from 30 to 300 μm, residual foil thickness r remaining after formation of the channels (2) in the metal foils (1) ranging from 30 to 300 μm and said base plate (5) having a thickness g ranging from 100 to 1,000 μm.

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