Metal fusion bonding – Process – Plural joints
Patent
1994-04-06
1994-11-15
Ramsey, Kenneth J.
Metal fusion bonding
Process
Plural joints
228 33, 228219, 118 50, B23K 300
Patent
active
053640110
ABSTRACT:
A micro soldering apparatus and method comprising a system (10) for attaching an electronic component (12) to a substrate (14). The system (10) comprises a soldering tool (16) including a dispensing orifice assembly (18) for pulsatingly dispensing a controlled quantity of molten solder (19) to a component (12) and substrate (14) so that the component is joined to the substrate (14) mechanically and electrically upon solidification of the molten solder (19). There is no physical contact between the dispensing orifice assembly (18) and joint. The system (10) also includes a controller for the soldering tool (16). The controller functions in response to process control parameters so that the controlled quantity of molten solder (19) is dispensed through a non-oxidizing atmosphere by a pressure pulse applied to the molten solder.
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Baker Jay D.
Green Wells L.
Lemecha Myron
McMillan, II Richard K.
Merala Thomas B.
Ford Motor Company
May Roger L.
Mollon Mark L.
Ramsey Kenneth J.
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