Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2002-10-08
2008-09-23
Rose, Kiesha L (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
Reexamination Certificate
active
07427808
ABSTRACT:
The present invention describes a microsensor with a sensor element (2) and an integrated circuit (1), containing a semiconductor body (11) with an intergrated circuit (4), the sensor element (2) being positioned on a main surface (12) of the semiconductor body (11) and there being a eutectic connection (3) formed between the semiconductor body (11) and the sensor element (2).
REFERENCES:
patent: 5668033 (1997-09-01), Ohara et al.
patent: 5831162 (1998-11-01), Sparks et al.
patent: 5923995 (1999-07-01), Kao et al.
patent: 6520014 (2003-02-01), Brandl
patent: 2002/0170175 (2002-11-01), Aigner et al.
patent: 19617696 (1997-11-01), None
patent: 10027234 (2000-12-01), None
patent: 19962231 (2001-07-01), None
patent: 0 528 551 (1993-02-01), None
patent: 0 772 045 (1997-05-01), None
patent: 0828346 (1998-03-01), None
patent: 1 096 259 (2001-05-01), None
Initial Preliminary Examination Report (Translation) for Application PCT/EP2002/011256.
Wolffenbuttel R.F. “Low-temperature intermediate Au-Si wafer bonding; eutectic or silicide bond” Sensors and Actuators A, 62 (1997) pp. 680-686.
Wolffenbuttel R.F. “Low-temperature silicon wafer to wafer bonding using gold at eutectic temperature” Sensors and Actuators A, 43 (1994) pp. 223-229.
Schmidt M.A.: “Wafer to Wafer Bonding for Microstructure Formation” Proc of the IEEE, vol. 86, No. 8, Aug. 1998 pp. 1575-1585.
Brandl Manfred
Csernicska Robert
Austriamicrosystems AG
Rose Kiesha L
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