Micro-scale interconnect device with internal heat spreader...

Details Micro-scale interconnect device with internal heat spreader... Micro-scale interconnect device with internal heat spreader...

2005-01-25

2005-01-25

Thompson, Craig A. (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S720000, C438S122000, C029S884000, C361S688000

Reexamination Certificate

active

06847114

ABSTRACT:
A micro-scale interconnect device with internal heat spreader and method for fabricating same. The device includes first and second arrays of generally coplanar electrical communication lines. The first array is disposed generally along a first plane, and the second array is disposed generally along a second plane spaced from the first plane. The arrays are electrically isolated from each other. Embedded within the interconnect device is a heat spreader element. The heat spreader element comprises a dielectric material disposed in thermal contact with at least one of the arrays, and a layer of thermally conductive material embedded in the dielectric material. The device is fabricated by forming layers of electrically conductive, dielectric, and thermally conductive materials on a substrate. The layers are arranged to enable heat energy given off by current-carrying communication lines to be transferred away from the communication lines.

REFERENCES:
patent: 5728248 (1998-03-01), Weber
patent: 6040984 (2000-03-01), Hirakawa

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