Micro probe ring assembly and method of fabrication

Details Micro probe ring assembly and method of fabrication Micro probe ring assembly and method of fabrication

1997-09-30

2000-01-11

Do, Diep N.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324754, G01R 3102

Patent

active

060140321

ABSTRACT:
A multi-probe ring assembly including integral fine probe tips, conductive lines with terminal connection for testing semiconductor devices and a method of construction of the multi-probe ring assembly is described. The method of construction described utilizes the step of etching pits into silicon wafers to produce molds for forming the probe points. Semiconductor machining processes are used to complete the probe ring assembly.

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patent: 5202623 (1993-04-01), LePage
patent: 5419807 (1995-05-01), Akram et al.
patent: 5594358 (1997-01-01), Ishikawa et al.

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