Etching a substrate: processes – Forming or treating an article whose final configuration has...
Patent
1997-09-30
2000-05-09
Young, Lee
Etching a substrate: processes
Forming or treating an article whose final configuration has...
216 2, 29 2535, 29846, 29825, B44C 122, H05K 300
Patent
active
060599820
ABSTRACT:
A probe assembly including an integral fine probe tip, conductive line with terminal connection for testing semiconductor devices and a method of construction of the probe assembly is described. The method of construction described utilizes the step of etching pits into silicon wafers to produce molds for forming the probe point. Semiconductor machining processes are used to complete the probe assembly.
REFERENCES:
patent: 3731191 (1973-05-01), Bullard et al.
patent: 4312117 (1982-01-01), Robillard et al.
patent: 4801866 (1989-01-01), Wixley
patent: 4908112 (1990-03-01), Pace
patent: 4916002 (1990-04-01), Carver
patent: 4943719 (1990-07-01), Akamine et al.
patent: 4956923 (1990-09-01), Pettingell et al.
patent: 4968585 (1990-11-01), Albrecht et al.
patent: 5079600 (1992-01-01), Schnur et al.
patent: 5116331 (1992-05-01), Chapman
patent: 5116462 (1992-05-01), Bartha et al.
patent: 5202263 (1993-04-01), LePage
patent: 5289631 (1994-03-01), Koopman et al.
patent: 5406209 (1995-04-01), Johnson et al.
Maddix John Thomas
Palagonia Anthony Michael
Pikna Paul Joseph
International Business Machines - Corporation
Rushing, Jr. Bobby
Walsh Robert A.
Young Lee
LandOfFree
Micro probe assembly and method of fabrication does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Micro probe assembly and method of fabrication, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micro probe assembly and method of fabrication will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1061392