Micro probe assembly and method of fabrication

Etching a substrate: processes – Forming or treating an article whose final configuration has...

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216 2, 29 2535, 29846, 29825, B44C 122, H05K 300

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active

060599820

ABSTRACT:
A probe assembly including an integral fine probe tip, conductive line with terminal connection for testing semiconductor devices and a method of construction of the probe assembly is described. The method of construction described utilizes the step of etching pits into silicon wafers to produce molds for forming the probe point. Semiconductor machining processes are used to complete the probe assembly.

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