Communications: radio wave antennas – Antennas – Microstrip
Patent
1995-05-26
1999-05-11
Lee, Benny T
Communications: radio wave antennas
Antennas
Microstrip
343853, 333247, H01Q23/00;13/08
Patent
active
059032391
ABSTRACT:
An antenna apparatus comprises: a first chip having: a substrate; a ground film on the substrate; a dielectric film on the ground film; a micro-patch antenna on the dielectric film; a microstrip line extending from the micro-patch antenna; and an in/output microstrip line on the dielectric film; a second chip having a circuit for effecting an operation with the antenna; and a connecting portion for fixing the second chip to the first chip by providing mechanical and electrical connection (flip-chip bonding) between the circuit and the microstrip line and between the circuit and the in/output microstrip line. The substrate comprises a silicon, a GaAs substrate, or a dielectric substrate. The antenna may be provided on the bottom surface of the substrate and be provided on a third substrate also connected by the flip-chip bonding wherein the second chip and the antenna is connected using a through hole. Instead of the through hole, the antenna is coupled to the circuit portion electromagnetically. The substrate may have a hollow portion and the second chip may be accommodated in the hollow portion and the antenna may be provided on a third chip covering the second chip.
REFERENCES:
patent: 4736454 (1988-04-01), Hirsch
patent: 4987425 (1991-01-01), Zahn et al.
patent: 5185613 (1993-02-01), Whatmore et al.
patent: 5386214 (1995-01-01), Sugawara
patent: 5400039 (1995-03-01), Araki et al.
patent: 5438697 (1995-08-01), Fowler et al.
patent: 5448249 (1995-09-01), Kushihi et al.
patent: 5510758 (1996-04-01), Fujita et al.
Fujita Suguru
Sagawa Morikazu
Takahashi Kazuaki
Lee Benny T
Matsushita Electric - Industrial Co., Ltd.
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