Micro-passage chip

Chemical apparatus and process disinfecting – deodorizing – preser – Chemical reactor – Bench scale

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C422S129000, C422S211000, C422S600000, C422S602000, C422S603000

Reexamination Certificate

active

08057743

ABSTRACT:
Means for overcoming the problems which the conventional glass microchannel chips have are disclosed. That is, a microchannel chip in which microchannels can be formed at a low cost, and which has a high chemical resistance is disclosed. The microchannel chip is constituted by a substrate made of carbon, which has a channel in its surface; and a cover composed of a glass plate bonded to the substrate. The cover is bonded to the substrate by heating at least a part of the contact surface at which the substrate is in contact with the cover.

REFERENCES:
patent: 6749813 (2004-06-01), David et al.
patent: 2004/0179980 (2004-09-01), Pattekar et al.
patent: 2007/0276972 (2007-11-01), Kikuchi et al.
patent: 2001297778 (2001-10-01), None
patent: 2003-172736 (2003-06-01), None
patent: 2003-311697 (2003-11-01), None
patent: 2004-66169 (2004-03-01), None
patent: 2004-73995 (2004-03-01), None
patent: 2006-51471 (2006-02-01), None
patent: 2007-144601 (2007-06-01), None
Machine translation of JP 2001-297778 A, which was published Oct. 26, 2001.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Micro-passage chip does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Micro-passage chip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micro-passage chip will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4264096

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.