Micro-mechanical semiconductor accelerometer

Details Micro-mechanical semiconductor accelerometer Micro-mechanical semiconductor accelerometer

1998-07-31

2000-08-22

Chapman, John E.

Measuring and testing

Speed, velocity, or acceleration

Acceleration determination utilizing inertial element

361280, G01P 15125

Patent

active

061054275

ABSTRACT:
A precision, micro-mechanical semiconductor accelerometer of the differential-capacitor type comprises a pair of etched opposing cover layers fusion bonded to opposite sides of an etched proofmass layer to form a hermetically sealed assembly. The cover layers are formed from commercially available, Silicon-On-Insulator ("SOI") wafers to significantly reduce cost and complexity of fabrication and assembly. The functional semiconductor parts of the accelerometer are dry-etched using the BOSCH method of reactive ion etching ("RIE"), thereby significantly reducing contamination inherent in prior art wet-etching processes, and resulting in features advantageously bounded by substantially vertical sidewalls.

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patent: 5504032 (1996-04-01), Gessner et al.
patent: 5614742 (1997-03-01), Gessner et al.
patent: 5623099 (1997-04-01), Schuster et al.
patent: 5905203 (1999-05-01), Flach et al.

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