Micro-machined structure production using encapsulation

Details Micro-machined structure production using encapsulation Micro-machined structure production using encapsulation

2010-03-19

2011-12-20

O'Hern, Brent (Department: 1783)

Stock material or miscellaneous articles

Hollow or container type article

Glass, ceramic, or sintered, fused, fired, or calcined metal...

C174S259000, C174S260000, C439S081000

Reexamination Certificate

active

08080293

ABSTRACT:
Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.

REFERENCES:
patent: 5200248 (1993-04-01), Thompson et al.
patent: 5613861 (1997-03-01), Smith et al.
patent: 5719073 (1998-02-01), Shaw et al.
patent: 6184053 (2001-02-01), Eldridge et al.
patent: 6290510 (2001-09-01), Fork et al.
patent: 6766817 (2004-07-01), da Silva
patent: 7015584 (2006-03-01), Chow et al.
patent: 7356920 (2008-04-01), Hantschel et al.

Affiliated with

Also associated with

Rating

Micro-machined structure production using encapsulation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Micro-machined structure production using encapsulation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micro-machined structure production using encapsulation will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4316720