Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-02-26
2010-06-08
Nguyen, Donghai D. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S841000, C257S773000, C439S081000
Reexamination Certificate
active
07730615
ABSTRACT:
Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.
REFERENCES:
patent: 5200248 (1993-04-01), Thompson et al.
patent: 5613861 (1997-03-01), Smith et al.
patent: 5719073 (1998-02-01), Shaw et al.
patent: 6184053 (2001-02-01), Eldridge et al.
patent: 6290510 (2001-09-01), Fork et al.
patent: 6766817 (2004-07-01), da Silva
patent: 7015584 (2006-03-01), Chow et al.
patent: 7356920 (2008-04-01), Hantschel et al.
Chow Eugene M.
Hantschel Thomas
Jagerson, Jr. Gordon Todd
Kosgalwies Sven
Bever Patrick T.
Bever Hoffman & Harms LLP
Nguyen Donghai D.
Palo Alto Research Center Incorporated
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