Micro lens and method and apparatus for fabricating

Optical: systems and elements – Single channel simultaneously to or from plural channels – By surface composed of lenticular elements

Reexamination Certificate

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C359S642000, C216S024000

Reexamination Certificate

active

06914724

ABSTRACT:
Micro lenses are fabricated using processes which operate on multiple lenses at a time. In one embodiment, wafer-scale processing includes employing photolithography for defining gray-scale masks which permit relatively smooth or continuous curvatures of lens surfaces to be formed by, e.g., reactive ion etching. Processes and materials are used which achieve desired etching at a sufficiently rapid rate such as etching to a depth of about 200 micrometers in less than about 10 hours. Wafer-scale molding processes can also be used. Diffractive features can be formed on or adjacent lens surfaces to provide functions such as dispersion correction. Also, sub-wavelength scale features may be etched to provide quarter-wave plate functionality, birefringence, anti-reflective functions and the like. Structures such as mounting rings and/or crash stops can be formed integrally with the lens body, eliminating the need to glue or otherwise couple separate components.

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Osamu Wada et al., “High-Performance, High-Reliability InP/GaInAs p-i-n Photodiodes And Flip-Chip Integrated Receivers For Lightwave Communications” 8217 Journal of Lightwave Technology vol. 9, Sep. 1991, New York, US, pp. 1200-1207.
Masao Makiuchi et al., “Flip-Chip Planar GaInAs/InP p-i-n Photodiodes Fabrication and Characteristics” Journal of Lightwave Technology, vol. 13, No. 11, Nov. 1995, pp. 2270-2275.

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