Micro lead frame packages and methods of manufacturing the same

Details Micro lead frame packages and methods of manufacturing the same Micro lead frame packages and methods of manufacturing the same

2007-04-10

2007-04-10

Lee, Calvin (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S672000

Reexamination Certificate

active

10972180

ABSTRACT:
A method of making a microelectronic package includes providing a lead frame having at least one bus element and a plurality of branches extending from the bus element, each branch including a terminal and an elongated lead extending between the bus element and the terminal. The method includes applying a carrier element to the lead frame to form a laminate with the branches adhering to a first surface of the carrier element, and severing the branches from the bus element, leaving the branches mechanically connected to one another by the carrier element so as to form an in-process unit. The method also includes assembling a microelectronic element with the in-process unit so that the microelectronic element overlies a second surface of the carrier element.

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