Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
Reexamination Certificate
2005-03-08
2005-03-08
McKinnon, Terrell (Department: 3743)
Heat exchange
Intermediate fluent heat exchange material receiving and...
Liquid fluent heat exchange material
C165S104210, C361S700000, C029S890032
Reexamination Certificate
active
06863118
ABSTRACT:
A heat pipe (100) includes a first substrate (102) including a plurality of first low fins (14) and high fins (16), and a second substrate (104) opposing the first substrate and including a plurality of second low fins (14) and high fins (16). A plurality of micro grooves (18) is formed between adjacent fins to form liquid channels (106) of the heat pipe. The first and second high fins are received in corresponding micro grooves of the heat pipe and soldered to the second and first substrates, respectively.
REFERENCES:
patent: 3680189 (1972-08-01), Noren
patent: 4046190 (1977-09-01), Marcus et al.
patent: 5179043 (1993-01-01), Weichold et al.
patent: 5219020 (1993-06-01), Akachi
patent: 5259448 (1993-11-01), Masukawa et al.
patent: 5465782 (1995-11-01), Sun et al.
patent: 5527588 (1996-06-01), Camarda et al.
patent: 5598632 (1997-02-01), Camarda et al.
patent: 5642775 (1997-07-01), Akachi
patent: 5697428 (1997-12-01), Akachi
patent: 6227287 (2001-05-01), Tanaka et al.
patent: 6269866 (2001-08-01), Yamamoto et al.
patent: 6298909 (2001-10-01), Fukatami et al.
patent: 20030136550 (2003-07-01), Tung et al.
patent: 20040069455 (2004-04-01), Lindemuth et al.
patent: 11-183067 (2001-12-01), None
Huang Chung-Yuan
Wang Yaxiong
Chung Wei Te
Hon Hai - Precision Ind. Co., Ltd.
McKinnon Terrell
LandOfFree
Micro grooved heat pipe does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Micro grooved heat pipe, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micro grooved heat pipe will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3436055