Micro-fluidic interconnector

Details Micro-fluidic interconnector Micro-fluidic interconnector

2011-08-30

2011-08-30

Aftergut, Jeff H (Department: 1746)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S294000, C156S304200, C422S504000

Reexamination Certificate

active

08007626

ABSTRACT:
A method of bonding a capillary tube made of a thermally deformable material to a passage in a glass wafer comprising the steps of treating the surface of the capillary tube to render the surface bondable and wettable by a conventional epoxy resin; inserting a support inside the capillary to prevent inward deformation of the capillary during subsequent fabricating steps; inserting the supported capillary inside the port on the wafer; heating an end of the capillary proximate a bottom portion of the port to effect melting of a portion of the heated end of the capillaries; moving the melted end of the capillary into contact with a wall of the port at a desired location for the capillary in the port, thus forming a temporary seal between the capillary and the wall of the port; and introducing an epoxy around the capillary to bind the capillary to the wafer.

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