Micro-fluid ejection heads and methods for bonding...

Details Micro-fluid ejection heads and methods for bonding... Micro-fluid ejection heads and methods for bonding...

2007-08-31

2010-10-19

Feggins, K. (Department: 2861)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

Reexamination Certificate

active

07815289

ABSTRACT:
A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is hermetically sealed and bonded to a support material, and a method of bonding a silicon device, such as a micro-fluid ejection head, to a support material.

REFERENCES:
patent: 7287831 (2007-10-01), Silverbrook

Affiliated with

Also associated with

Rating

Micro-fluid ejection heads and methods for bonding... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Micro-fluid ejection heads and methods for bonding..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micro-fluid ejection heads and methods for bonding... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4238873