Micro-fluid ejection head containing reentrant fluid feed slots

Semiconductor device manufacturing: process – Manufacture of electrical device controlled printhead

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S706000, C438S712000, C438S713000, C347S020000, C347S040000, C347S063000, C216S027000

Reexamination Certificate

active

07413915

ABSTRACT:
Methods of micro-machining a semiconductor substrate to form through fluid feed slots therein. One method includes providing a semiconductor substrate wafer having a thickness greater than about 500 microns and having a device side and a back side opposite the device side. The back side of the wafer is mechanically ground to provide a wafer having a thickness ranging from about 100 up to about 500 microns. Dry etching is conducted on the wafer from a device side thereof to form a plurality of reentrant fluid feed slots in the wafer from the device side to the back side of the wafer.

REFERENCES:
patent: 5268065 (1993-12-01), Grupen-Shemansky
patent: 5611888 (1997-03-01), Bosch et al.
patent: 5626716 (1997-05-01), Bosch et al.
patent: 5693182 (1997-12-01), Mathuni
patent: 6402301 (2002-06-01), Powers et al.
patent: 6555480 (2003-04-01), Milligan et al.
patent: 2003/0224583 (2003-12-01), Chang et al.
patent: 2005/0110829 (2005-05-01), Keenanet al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Micro-fluid ejection head containing reentrant fluid feed slots does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Micro-fluid ejection head containing reentrant fluid feed slots, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micro-fluid ejection head containing reentrant fluid feed slots will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4007541

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.