Semiconductor device manufacturing: process – Manufacture of electrical device controlled printhead
Reexamination Certificate
2004-12-01
2008-08-19
Smith, Zandra (Department: 2822)
Semiconductor device manufacturing: process
Manufacture of electrical device controlled printhead
C438S706000, C438S712000, C438S713000, C347S020000, C347S040000, C347S063000, C216S027000
Reexamination Certificate
active
07413915
ABSTRACT:
Methods of micro-machining a semiconductor substrate to form through fluid feed slots therein. One method includes providing a semiconductor substrate wafer having a thickness greater than about 500 microns and having a device side and a back side opposite the device side. The back side of the wafer is mechanically ground to provide a wafer having a thickness ranging from about 100 up to about 500 microns. Dry etching is conducted on the wafer from a device side thereof to form a plurality of reentrant fluid feed slots in the wafer from the device side to the back side of the wafer.
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Krawczyk John W.
McNees Andrew L.
Warner Richard L.
Lexmark International Inc.
Luedeka Neely & Graham PC
Perkins Pamela E
Smith Zandra
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