Micro-fluid ejection assemblies

Incremental printing of symbolic information – Ink jet – Ejector mechanism

Reexamination Certificate

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C430S230000, C216S027000

Reexamination Certificate

active

10823939

ABSTRACT:
A micro-fluid ejection assembly including a silicon substrate having accurately formed fluid paths therein. The fluid paths are formed by a deep reactive ion etching process conducted on a substrate having a surface characteristic before etching selected from the group consisting of a dielectric layer thickness of no more than about 5000 Angstroms, and a substantially dielectric material free pitted surface wherein a root mean square depth of surface pitting is less than about 500 Angstroms and a maximum surface pitting depth is no more than about 2500 Angstroms. Fluid paths in such substrates having improved flow characteristics for more reliable fluid ejection operations.

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