Active solid-state devices (e.g. – transistors – solid-state diode – Thermoelectric cooling
Reexamination Certificate
2007-04-17
2007-04-17
Owens, Douglas W. (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Thermoelectric cooling
C062S003200
Reexamination Certificate
active
10353632
ABSTRACT:
A micro-fabricated device, includes a support structure having an aperture formed therein, and a device substrate disposed within the aperture. The micro-fabricated device further includes a thermally isolating structure thermally coupling the device substrate to the support structure. The thermally isolating structure includes at least one n-doped region and at least one p-doped region formed on or in the thermally isolating structure and separated from each other. In addition, the thermally isolating structure includes an electrical interconnect connecting at least one n-doped region and at least one p-doped region, forming an integrated thermoelectric device.
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Chen Chien-Hua
Liebeskind John
McKinnell James C.
Gebremariam Samuel A
Owens Douglas W.
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