Micro-electronics devices and methods of manufacturing same

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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156 89, 428901, B05D 512

Patent

active

048658758

ABSTRACT:
A low dielectric constant material for use in the formation of thick film circuits such as VLSI devices. The material comprises a thick film insulation matrix of standard viscosity; a thick film organic vehicle; and a plurality of dry, hollow, glass microspheres. The insulation matrix, vehicle, and microspheres are thoroughly combined into a homogeneous material of standard viscosity.

REFERENCES:
patent: 4134848 (1979-01-01), Adicoff et al.
patent: 4238641 (1980-12-01), Planting et al.
patent: 4382821 (1983-05-01), Davis et al.
patent: 4403107 (1983-09-01), Hoffman
patent: 4426320 (1984-01-01), Davis et al.
Low Dielectric Constant Material for Printed Circ. Bds., IBM Tech. Discl. Bull., vol. 22, No. 5 (Oct. 1979), Haining et al, p. 1799.

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