Micro-electronic assembly including a flip-chip mounted micro-de

Details Micro-electronic assembly including a flip-chip mounted micro-de Micro-electronic assembly including a flip-chip mounted micro-de

1996-07-29

1999-01-05

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361764, H05K 118

Patent

active

058569146

ABSTRACT:
A micro-electronic assembly, a substrate for use in the assembly and an associated method are disclosed herein. The substrate includes an outer surface configuration defining an aperture within a first surface and electrically conductive leads on the first surface. In the overall micro-electronic assembly, a micro-device includes an active surface supporting at least one component which projects outwardly from the surface. The micro-device further includes electrically conductive bumps on the active surface. The micro-device is positioned on the first surface of the substrate such that the projecting component extends at least partially into the aperture defined by the substrate and so that the electrically conductive leads of the micro-device are electrically engaged with the electrically conductive leads of the substrate.

REFERENCES:
patent: 4285002 (1981-08-01), Campbell
patent: 4843188 (1989-06-01), Patterson et al.
patent: 4906957 (1990-03-01), Wilson
patent: 5072331 (1991-12-01), Thiele et al.
patent: 5406454 (1995-04-01), Dinger et al.
patent: 5591959 (1997-01-01), Cigna et al.
patent: 5760478 (1998-06-01), Bozso et al.

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