Micro-electromechanical system

Details Micro-electromechanical system Micro-electromechanical system

2005-12-27

2005-12-27

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

C438S022000, C438S007000, C438S017000, C438S029000

Reexamination Certificate

active

06979585

ABSTRACT:
A microelectromechanical system (MEMS) device is created by forming mechanical structures supported by a substrate having a bond ring area laterally spaced from the mechanical structures and having a sacrificial layer surrounding the mechanical structures. A bond ring material is formed on top of the sacrificial layer and the bond ring area. Some of the bond ring material is then removed to create a bond ring.

REFERENCES:
patent: 4062623 (1977-12-01), Suzuki et al.
patent: 5589082 (1996-12-01), Lin et al.
patent: 6822326 (2004-11-01), Enquist et al.
patent: 6873450 (2005-03-01), Patel et al.
patent: 2005/0017313 (2005-01-01), Wan

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