Micro electro-mechanical variable capacitor

Details Micro electro-mechanical variable capacitor Micro electro-mechanical variable capacitor

2005-06-14

2005-06-14

Dinkins, Anthony (Department: 2831)

Electricity: electrical systems and devices

Electrostatic capacitors

Variable

C361S278000, C361S290000, C361S299300

Reexamination Certificate

active

06906905

ABSTRACT:
A three-dimensional micro electro-mechanical (MEMS) variable capacitor is described wherein movable comb electrodes of opposing polarity are fabricated simultaneously on the same substrate are independently actuated. These electrodes are formed in an interdigitated fashion to maximize the capacitance of the device. The electrodes are jointly or individually actuated. A separate actuation electrode and a ground plane electrode actuate the movable electrodes. The voltage potential between the two electrodes provides a primary mode of operation of the device. The variation of the sidewall overlap area between the interdigitated fingers provides the expected capacitance tuning of the device. The interdigitated electrodes can also be attached on both ends to form fixed-fixed beams. The stiffness of the electrodes is reduced by utilizing thin support structures at the ends of the electrodes. The three dimensional aspect of the device avails large surface area. Large capacitance variation and tuning ranges are obtained by independent actuation of the electrode fingers. A plurality of modes of operation of the device provides wide flexibility and greater performance advantage for the device. Upon fabrication of the device, a separate substrate with etched dielectric is used to encapsulated the device. The MEMS device is then completely encapsulated, requiring no additional packaging of the device. Further, since alignment and bonding can be done on a wafer scale, an improved device yield is obtained at a lower cost.

REFERENCES:
patent: 6275034 (2001-08-01), Tran et al.
patent: 6633260 (2003-10-01), Paschen et al.
patent: 6649852 (2003-11-01), Chason et al.

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