Micro-dimensional coupling conductor

Details Micro-dimensional coupling conductor Micro-dimensional coupling conductor

1997-04-18

2000-07-11

Kincaid, Kristine

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174117FF, 1741261, H01L 2302

Patent

active

060875852

ABSTRACT:
A micro-dimensional coupling conductor with a shape that is customized for a particular electronic device. A fabrication method is used in which the physical dimensions of the conductor are precisely controlled with photolithographic techniques, resulting in a conductor that is more precisely tuned to the operating frequency of the device. The conductor is fabricated on an SiO.sub.2 substrate using vacuum deposition techniques. After fabrication, the conductor is separated from the SiO.sub.2 substrate by dissolving the SiO.sub.2. Alternatively, the conductor may be fabricated on a Teflon.TM. substrate. The use of a Teflon substrate allows a user to remove the conductor from the substrate by applying a small mechanical force to the conductor.

REFERENCES:
patent: 5276423 (1994-01-01), Breit et al.
patent: 5668410 (1997-09-01), Yamamoto
patent: 5704593 (1998-01-01), Honda
D. V. Morgan and K. Board, An Introduction to Semiconductor Microtechnology (Second Edition), John Wiley & Sons, Chichester (1990), pp. 111-114.

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