Micro-chip fuse and method of manufacturing the same

Details Micro-chip fuse and method of manufacturing the same Micro-chip fuse and method of manufacturing the same

1994-09-30

1997-02-25

Picard, Leo P.

Electricity: electrothermally or thermally actuated switches

Electrothermally actuated switches

Fusible element actuated

337297, 337282, 29623, H01H 8504, H01H 8538, H01H 6902

Patent

active

056063016

ABSTRACT:
A micro-chip fuse and a method of manufacturing the fuse is disclosed which includes a fusible element made of a metallic film that is formed by a depositioning process. Through-bores are provided through a first substrate and filled with a photosensitive resist to make smooth the surface of the first substrate. After curing the resist, metal is deposited on the surface of the first substrate to form a metallic film. A photosensitive resist is applied to the metallic film and a photomask is placed on the resist to effect an exposure and a development. The metallic film is etched and the resists are removed to form the fusible elements made of the metallic film extending over the through-bores. A second substrate is placed under the first substrate, and a third substrate including recesses for cover the through-bores is placed on the first substrate to laminate them. Electrodes are provided on the ends of the substrates. The laminated substrates are divided into individual micro-chip fuses.

REFERENCES:
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patent: 3261951 (1966-07-01), Jacobs
patent: 4135175 (1979-01-01), Perreault
patent: 4215331 (1985-03-01), Kozacka
patent: 4503415 (1985-03-01), Rooney
patent: 4599596 (1986-07-01), Arikawa
patent: 4608548 (1986-08-01), Borzoni
patent: 4748491 (1988-05-01), Takagi

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