Micro-chimney and thermosiphon die-level cooling

Details Micro-chimney and thermosiphon die-level cooling Micro-chimney and thermosiphon die-level cooling

2005-10-26

2009-02-10

Ciric, Ljiljana (Lil) V (Department: 3744)

Heat exchange

Structural installation

Heating and cooling

Reexamination Certificate

active

07487822

ABSTRACT:
A method and arrangement for dissipating heat from a localized area within a semiconductor die is presented. A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is at least partially filled with a heat-dissipating material. The conduit portion absorbs heat from the localized area and dissipates at least a portion of the heat away from the localized area. As such, thermal stress on the die is reduced, and total heat from the die is more readily dissipated.

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